Original Assignee Advanced Micro Devices Inc Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.) Prejean Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.) Active, expires Application number US11/133,108 Inventor Roy Mark Miller Seth J. Google Patents System and method of detecting IC die cracksÄownload PDF Info Publication number US7649200B1 US7649200B1 US11/133,108 US13310805A US7649200B1 US 7649200 B1 US7649200 B1 US 7649200B1 US 13310805 A US13310805 A US 13310805A US 7649200 B1 US7649200 B1 US 7649200B1 Authority US United States Prior art keywords die conductive line node location metal layer Prior art date Legal status (The legal status is an assumption and is not a legal conclusion. Google Patents US7649200B1 - System and method of detecting IC die cracks US7649200B1 - System and method of detecting IC die cracks
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